Intrinsic Area Array ICs: What, Why, and How

نویسندگان

  • Peyman Dehkordi
  • Chandra Tan
  • Donald Bouldin
چکیده

Area-array bonding technology (i.e. Flip-chip, C4) was pioneered by IBM in the late 1960’s as an alternative to periphery bonding technology (i.e. wire-bond). In recent years, several commercial companies have started offering bumping and flip-chip services. Flip-chip technology is expected to grow at at compound annual growth rate of 38% through the year 2001 [1]. The purpose of this paper is to address the IC design issues and alternatives that are presently being used for area-array bonding technology and show the impact of these design issues at the system level.

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تاریخ انتشار 1997